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GN-Ultimate 10 W Thermal Putty, 50 g

Putty & Phase Change

GN-Ultimate 10 W Thermal Putty, 50 g

4.2 10 ratingscounted across all 3 pack sizes of this compound

GN-Ultimate 10 W thermal putty, 50 g: the higher-conductivity moldable filler for demanding uneven gaps.

$40.99

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Model
TN-GN10-02
Color
Turquoise
Category
Putty & Phase Change

This is the same idea as the 6 W putty with more capability in the material itself. At 10 W/mK in a 50 g jar, GN-Ultimate is aimed at the joints where a compliant filler is the only practical answer and the heat load is real: power modules, shared heatsinks across mismatched chips, high-output LEDs and graphics hardware being run hard.

  1. Higher conductivity where shape rules out a pad

    The usual compromise with putty is accepting a less capable material in exchange for fitting an awkward gap. At 10 W/mK that compromise is a good deal smaller. It means an assembly with wildly different component heights no longer has to be the coolest-running part of the board only in theory.

  2. Shared heatsinks over mismatched chips

    A single plate covering several packages of different heights is the classic case. Each chip needs a different distance filled, and cutting three pad thicknesses to suit means three chances of getting one wrong. One material pressed across all of them settles at whatever each one requires.

  3. Density and what it implies

    At 3.3 g per cubic centimeter this is a heavily loaded material, which is where the conductivity comes from and also why a small ball of it weighs more than expected. Judge quantity by eye against the gap rather than by feel, and remember that the jar holds far more applications than its size suggests.

  4. Rated well beyond consumer temperatures

    The stated range runs from -30 C to 200 C, which is far outside anything a desktop will produce and squarely in the territory of power electronics and industrial hardware. For a PC that headroom simply means the material is nowhere near its limits when a card is at full load.

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