GC-4 Thermal Paste, 3.5 g
3.5 g syringe
4.7 188 ratingscounted across all 2 pack sizes of this compound
Paste is for joints that already touch: an IHS under a cold plate, a bare die under a heatsink. The layer only has to fill the microscopic roughness of two machined surfaces, which is why a gram goes a long way and why thickness is the enemy.
3.5 g syringe
4.7 188 ratingscounted across all 2 pack sizes of this compound
| Thermal pad | Thermal paste | Phase change | |
|---|---|---|---|
| Gap it can fill | Fixed 0.5 – 3.0 mm | Microscopic only | 0.2 mm, self-levelling |
| Conductivity here | 12 – 15 W/mK | 3.8 – 8.5 W/mK | Paste-class once melted |
| Goes on | Peel and lay flat | Pea, line or spread | Drop in dry, heat once |
| Comes off | In one piece | Wipe with alcohol | Scrape after cooling |
| Reusable | Usually yes | No | No |
| Made for | VRM blocks, VRAM, M.2 drives | CPU and GPU dies under a cold plate | Laptops and set-and-forget builds |
Silicone gap fillers from 12 to 15 W/mK, cut to size for VRM blocks, M.2 drives and graphics-card memory.
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