
Thermal Paste
GC-4 Thermal Paste, 3.5 g
4.7 188 ratingscounted across all 2 pack sizes of this compound
GC-4 in the standard 3.5 g syringe: the everyday high-conductivity paste for CPU and GPU reassembly.
$4.99
In stock
Sold and shipped by an authorized retail partner. Price shown was current when this page was built.
Check price and buy- Model
- TC-GC-04-A
- Category
- Thermal Paste
This is the size most people should buy. A 3.5 g syringe of GC-4 covers a processor many times over, costs little per application, and does not deteriorate between them because the compound does not cure. For a bench that reseats a cooler every few months it is the default rather than a considered purchase.
The size that matches how paste gets used
Paste is consumed in tiny amounts and wasted in large ones, usually by drying out in a syringe that was opened once. Since this compound is stable in the tube, the right quantity to buy is whatever gets used before the syringe is lost rather than whatever gets used before it spoils. For most people that is around this size.
One compound for processor and card
The same paste goes between a CPU heatspreader and its cooler, and between a graphics core and its cold plate. There is no separate formulation for either and no reason to keep two syringes. Where the two jobs differ is in the pads around the core, not in the compound on it.
Reapplying is not an annual chore
A properly applied non-curing paste does not need refreshing on a schedule. Redo it when the cooler comes off for another reason, when temperatures have drifted upward over months rather than minutes, or when you find the old layer dried at the edges. Pulling a working cooler to change good paste achieves nothing.
Getting the old layer off first
New paste over old is a worse interface than either alone, because the old layer is already loaded with whatever it picked up. Wipe both faces with a paper towel, then finish with isopropyl on a lint-free cloth and let them dry. The metal should look like metal before anything new goes on.
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