GN-Ultimate 10 W Thermal Putty, 50 g
50 g jar
4.2 10 ratingscounted across all 3 pack sizes of this compound

Putty & Phase Change
3.9 43 ratings
HeatPhase Ultra for AMD sockets: a 40 x 40 mm phase-change pad at 0.2 mm and 8.5 W/mK, no paste required.
$10.99
In stock
Sold and shipped by an authorized retail partner. Price shown was current when this page was built.
Check price and buyThe AMD-sized piece of the same phase-change material, square at 40 x 40 mm to suit the larger heatspreader on those packages. It goes on solid, softens under load into an interface layer, and is rated 8.5 W/mK at a thickness of 0.2 mm. Non-electrically conductive and non-curing, like everything else on these shelves.
AMD desktop packages present a broader lid than the Intel equivalents, and this piece is dimensioned for it. Placing it is the whole installation: lay it centered on the cold lid, seat the cooler, tighten evenly, and let the first load cycle do the rest of the work.
The one thing a manual paste application never quite repeats is the amount. A 0.2 mm pad is the same on every machine and in every pair of hands, which is why phase-change material turns up in production assembly and in shops that need the tenth build of the day to match the first.
Do not judge temperatures on the first minute. The material needs to reach its transition point and wet both surfaces before it is doing its final job, so give the machine a proper load for a while and read the numbers after they have settled. An early reading will look worse than the truth.
After the first cycle the layer stays put: it does not cure, does not harden into a crust and is not pumped out of the joint by ordinary heat cycling the way a thin paste can be. On a machine that runs hot and steady that stability is the argument for using it at all.
50 g jar
4.2 10 ratingscounted across all 3 pack sizes of this compound
12 W/mK · 80 × 40 × 0.5 mm
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1 g syringe
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15 W/mK · 90 × 50 × 0.5 mm
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